COPPER CLAD FR4
Our FR4 Copper Clad Laminates are a fire rated Electrical Grade, dielectric fiberglass material created under high pressure with electro deposited HTE (high-temperature elongated) Copper Laminated onto the FR4 substrate. It is commonly used for PCBs.
Material Structure and Electrical Integration
Copper clad laminates combine a reinforced substrate with electro deposited copper to create a stable platform for electrical pathways, thermal management, and mechanical support. These materials are engineered to maintain consistent conductivity while providing the rigidity needed for fabrication, drilling, routing, and component mounting. The copper layer bonds uniformly to the substrate, supporting clean etching and reliable circuit formation.
Substrate Options and Performance Profiles
Copper clad materials are available on multiple reinforced bases, each offering distinct mechanical and thermal characteristics. Options include G10/FR4, G11/FR5, Non Brominated G10, and G9. These substrates provide varying levels of heat resistance, dielectric behavior, and structural strength, allowing engineers to match material selection to electrical load, environmental exposure, and fabrication requirements. The copper layer is available in multiple weights to support signal integrity, current carrying capacity, and thermal dissipation.
Role in Electrical and Electronic Assemblies
Copper clad laminates serve as foundational materials for printed circuit boards, electrical insulation structures, and precision electronic components. Their stability under machining and thermal cycling makes them suitable for:
- PCB fabrication
- Insulating plates with conductive pathways
- High temperature electrical assemblies
- Prototype and short run circuit development
- Structural components requiring integrated copper surfaces
The combination of mechanical strength and electrical functionality supports both low volume development and high volume production environments.